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Packaging & Memory
Chiplets, 3D IC, HBM stacks, DDR5/PCIe lanes, and bandwidth tradeoffs.
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Kioxia LD4 E1.L QLC NVMe SSD Announced
6+ hour, 6+ min ago (230+ words) The Kioxia LD4 is a higher-capacity E1.L NVMe SSD designed to cram a lot of sorage while taking a minimal amount of faceplate area The post Kioxia LD4 E1.L QLC NVMe SSD Announced appeared first on ServeTheHome. Kioxia has introduced its first…...
Xsight Labs E1L DPU for Lower-Power 200Gbps DPUs
6+ hour, 6+ min ago (274+ words) Patrick has been running STH since 2009 and covers a wide variety of SME, SMB, and SOHO IT topics. Patrick is a consultant in the technology industry and has worked with numerous large hardware and storage vendors in the Silicon Valley....
Applied Materials, Inc. And KIOXIA Corporation Partner At The EPIC Center To Advance Next-Generation Memory Technology
17+ hour, 37+ min ago (275+ words) Applied Materials, Inc. announced that KIOXIA Corporation will join Applied?s EPIC Center in Silicon Valley as an innovation partner to advance next-generation memory technologies. The companies will... announced that KIOXIA Corporation will join Applied?s EPIC Center in Silicon…...
Applied Materials, Besi Expand Advanced Packaging Partnership for AI Scaling
6+ day, 19+ hour ago (499+ words) Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon…...
United States Advanced Semiconductor Packaging Market Forecast, 2025-2031 | AI, 5G, 3D Integration, and Fan-Out Packaging Unlock Growth Opportunities
2+ day, 3+ hour ago (273+ words) Boost ROI through 3D and fan-out packaging, AI-driven automation, strategic R&D partnerships, and expansion into AI, 5G, automotive, data center, and IoT applications Dublin, Oct. 06, 2026 (GLOBE NEWSWIRE) -- "Advanced Semiconductor Packaging Market in the United States" has been added to ResearchAndMarkets.com's…...
From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test
6+ hour, 34+ min ago (119+ words) An integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies. The post From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test appeared first on Semiconductor Engineering. The explosive…...
The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control
6+ hour, 35+ min ago (284+ words) The next frontier in process control isn’t just visual—it’s electrical. The post The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control appeared first on Semiconductor Engineering. The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control The next…...
Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging
6+ hour, 30+ min ago (273+ words) How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow. In advanced packaging, value accumulates layer by layer, component by component, and process step by process step....
Breaking the Monolithic Limit: How 'Advanced Packaging (2.5D/3D)' and HBM4 Are Reshaping the Semiconductor Hegemony
6+ day, 8+ hour ago (77+ words) Introduction: The 'Moore's Law' Wall Hitting the Semiconductor IndustryFor many years, 'Moore's Law' (the doubling of transistor density every two years) has reigned as the absolute principle of the semiconductor industry, but it is now facing clear physical and economic…...
Physical Consequences of the 2048-bit Bus Transition Seen in Doubling HBM4 Production: Structural Transformation of High-Bandwidth Memory Accelerated by Custom DRAM
5+ day, 21+ hour ago (470+ words) 1. Overview of the Event Samsung Electronics has solidified a policy to more than double its production capacity for next-generation high-bandwidth memory, "HBM4" and "HBM4E," compared to its original plans. In response to the demand for resolving memory bandwidth bottlenecks in AI accelerators…...