CPUs & Processors

Desktop, mobile, and server silicon — architectures, sockets, thermals, and tuning.

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theverge.com > tech > 1005397 > amd-intends-to-substantially-increase-its-chip-supply-next-year

AMD intends to ‘substantially’ increase its chip supply next year.

3+ day, 14+ hour ago   (145+ words) “We’ve been able to increase our supply as we’ve gone through 2026,” CEO Lisa Su said today, “and ​we’re going to substantially increase our supply in 2027.” Like Nvidia, AMD has seen a boom in GPU demand driven by AI, signing big…...


techtimes.com > articles > 328746 > 20/26/1007 > lisa-su-flew-seoul-twice-seven-months-amds-ai-roadmap-depends-korea.htm

Lisa Su Flew to Seoul Twice in Seven Months; AMD’s AI Roadmap Depends on Korea

2+ day, 5+ hour ago   (1321+ words) AMD HBM4 supply talks in Seoul: AMD CEO Lisa Su met Samsung and SK Hynix executives Wednesday to lock in multi-year supply of high-bandwidth memory for the Helios rack-scale AI platform, which requires 31 terabytes of HBM4 per rack across 72 MI455X GPUs -- capacity controlled…...


teknogadyet.com > 2026 > 10 > asus-zenbook-14-ux3480-philippines.html

ASUS Zenbook 14 (UX3480) Launched in PH: Copilot+ AI Specs, Ceraluminum Body, & Price Starts at ₱76,995

10+ hour, 15+ min ago   (216+ words) Editor’s Note: This article details the official Philippine release of the ASUS Zenbook 14 (UX3480) matching the direct, value-first editorial style of Teknogadyet.com. Hardware specifications, NPU benchmark ratings, retail prices, and bundled software reflect official ASUS Philippines press documentation updated for…...


teknogadyet.com > 2026 > 10 > top-reasons-to-buy-asus-vivobook-s16.html

More Screen, More Power, More Reasons to Love the ASUS Vivobook S16

10+ hour, 15+ min ago   (314+ words) What makes a laptop a good buy goes beyond its price tag. It’s about how well it meets the needs of its intended users. For the ASUS Vivobook S16, the appeal is obvious: a bigger screen for those who want more…...


medium.com > @technicalworld101 > a-high-quality-16-9-featured-blog-image-for-a-laptop-review-article-titled-dell-15-ryzen-5-6300d8b21c86

“A high-quality 16:9 featured blog image for a laptop review article titled ‘Dell 15 (Ryzen 5… | by technicalworld101 | Oct, 2026

11+ hour, 3+ min ago   (737+ words) A note before we start: this review is based on Dell’s specs and what published reviews and buyer feedback say about this model (the DC15255 / Dell 15). I haven’t had one on my desk, so treat it as research rather than a…...


writersuraj.medium.com > ryzen-5-vs-core-i5-which-laptop-processor-to-buy-631ce85434eb

Ryzen 5 vs Core i5: Which Laptop Processor Should Buyers Choose?

10+ hour, 25+ min ago   (184+ words) A generation-by-generation comparison to help students, professionals, gamers, and creators pick the right chip. Ask ten friends whether a Ryzen 5 or a Core i5 laptop is better, and you will get ten confident, conflicting answers. Most of them are partly right…...


wccftech.com > intel-wants-to-become-the-go-to-foundry-for-asics-and-specialized-chips-and-lip-bu-tans-secret-weapon-is-a-former-marvell-exec

Intel Wants To Become The Go-To Foundry For ASICs And Specialized Chips, And Lip-Bu Tan’s Secret Weapon Is A Former Marvell Exec

6+ hour, 46+ min ago   (316+ words) Intel is currently in the process of shedding its notoriously labyrinthine bureaucratic layers and the attendant inertia, while eyeing new markets and product categories for its fledgling advanced fabrication nodes, with the scorching-hot ASIC market serving as one such high-probability…...


techtimes.com > articles > 328800 > 20/26/1009 > competing-chipmakers-intel-tsmc-now-share-research-floor-applied-materials-epic-center.htm

Competing Chipmakers Intel and TSMC Now Share Research Floor at Applied Materials EPIC Center

10+ hour, 40+ min ago   (314+ words) The structural novelty of Intel's EPIC Center entry is not simply that two large chipmakers are in the same building. It is that Intel Foundry and TSMC are direct competitors — they compete for the same fabless customer tape-outs — yet both…...


eetimes.com > connecting-chiplets-isnt-enough-solving-the-data-movement-challenge-in-multi-die-systems

Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems

11+ hour, 40+ min ago   (92+ words) Date: Thursday, November 5, 2026 Time: 11:00am PST | 2:00pm EST | 18:00 CET As SoCs evolve into multi-die systems, getting data across a die-to-die interface is only part of the challenge. Architects must also preserve traffic behavior, bandwidth efficiency and quality of service as communication moves…...


eetimes.com > scaling-3d-ic-design-trends-challenges-and-practical-workflows

Scaling 3D IC design: Trends, Challenges and Practical Workflows

18+ hour, 30+ min ago   (133+ words) 3D IC architectures are enabling the next generation of AI, HPC, and advanced semiconductor systems – but scaling these designs introduces new challenges across heterogeneous integration, die-to-die connectivity, thermal behavior, power delivery, and system-level verification. In this webinar, an industry analyst from…...