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News
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
16+ hour, 18+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
CXMT and YMTC Stockpile ASML Tools for Three-Year Expansion Plans
6+ day, 5+ hour ago (213+ words) TechPowerUp CXMT and YMTC Stockpile ASML Tools for Three-Year Expansion Plans - Feb 13th 2026 US Government Reportedly Removed CXMT & YMTC from Restricted Chinese Tech Firm List (1) - Jul 13th 2026 Chinese CXMT to Match Micron's DRAM Manufacturing Capacity This Year (28) - Aug 23rd 2026 United States Government May…...
Samsung plans High-NA EUV for DRAM production by 2028
6+ day, 6+ hour ago (292+ words) The memory giant's partnership with ASML could make it the first chipmaker to bring next-gen lithography to DRAM manufacturing Samsung Electronics is betting that the most expensive machines ever built for chipmaking will give it a decisive edge in the…...
Samsung, ASML Deepen Deal on High NA EUV Chips
6+ day, 8+ hour ago (227+ words) Samsung expands ASML partnership, targets High NA EUV DRAM by 2028 The Tech Buzz may earn a commission when you buy through links on this page. This never affects which products we recommend or what we say about them. Samsung Electronics…...
Samsung and ASML expand High NA EUV push for next-gen DRAM
6+ day, 9+ hour ago (151+ words) The collaboration will also see Samsung target the use of ASML’s High NA EUV systems in high-volume DRAM manufacturing by 2028, which the companies say would be an industry first. Samsung said it will work with industry partners on the mask…...
Samsung will use ASML's advanced machines to make even better chips
6+ day, 10+ hour ago (196+ words) It will use High-NA EUV machines for mass production of DRAM chips in 2028. Chips being packaged at Samsung Foundry's plant Samsung is one of the world's largest semiconductor chipmakers. It continuously advances its chip fabrication capabilities each year. The company…...
Samsung, ASML deepen partnership to advance High-NA EUV
6+ day, 11+ hour ago (260+ words) Samsung Electronics and Dutch manufacturer of chip equipment ASML said Tuesday they would expand their long-standing partnership on next-generation lithography...
Samsung applies high NA EUV to DRAM by 2028, deepens ASML partnership
6+ day, 7+ hour ago (294+ words) Samsung Electronics will apply next-generation lithography equipment, "High NA extreme ultraviolet (EUV)," to advanced DRAM production in 2028. This is the first time Samsung Electronics will apply High NA EUV to mass production of DRAM. Samsung Electronics said on the 8th it…...
Huawei's new chip design tackles heat 55% while boosting density
6+ day, 20+ hour ago (542+ words) Huawei’s Tau Scaling Law design stacks chip layers to boost density, reduce power use and tackle thermal limits. Huawei says a new vertically stacked semiconductor design can address one of the biggest problems facing its next-generation smartphone chips: heat. The…...
NanoBridge Semiconductor agrees chip development partnership with Siemens
1+ week, 9+ hour ago (343+ words) NanoBridge will offer a customised version of Siemens’ synthesis tool for its specialist low-power FPGA device families. Japan-based chipmaker NanoBridge Semiconductor has entered into an agreement with Siemens to use its Precision FPGA Synthesis tool for field-programmable gate array (FPGA)…...