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News


tspasemiconductor.substack.com > p > beyond-moores-law-the-rise-of-ai

Beyond Moore’s Law: The Rise of AI System Scaling :SEMICON Taiwan 2026 — From Advanced Packaging and CPO to Memory, Test, and Thermal Innovation

5+ day, 23+ hour ago   (357+ words) AI Semiconductors Enter the System Scaling Era: Advanced Packaging, CPO, HBM, FOPLP, and Testing Emerge as the Next Key Battlegrounds Based on SemiVision’s observations from the technical forums, industry discussions, and exhibition floor at SEMICON Taiwan 2026, the most important industry…...


tspasemiconductor.substack.com > p > when-ai-chips-depend-on-a-bottle

When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck

1+ week, 1+ day ago   (175+ words) semivision When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck Oroginal Article By SemiVision Research [Reading time: 10 mins] The semiconductor supply constraints created by the AI boom are moving progressively upstream. Over the…...


tspasemiconductor.substack.com > p > hot-chips-2026-hbm-base-die-evolves

Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM

1+ week, 1+ day ago   (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...


tspasemiconductor.substack.com > p > sk-hynix-breaks-ground-in-indiana

SK hynix Breaks Ground in Indiana: HBM’s Second Competitive Curve Is Supply-Chain Localization

2+ week, 10+ hour ago   (223+ words) The first “Made in USA” HBM will still begin with wafers fabricated in Korea. That is not a contradiction. It is a preview of how the AI semiconductor supply chain is being redesigned. The AI semiconductor boom is usually discussed…...


tspasemiconductor.substack.com > p > hbf-as-nand-adopts-an-hbm-like-architecture

HBF: As NAND Adopts an HBM-Like Architecture, the AI Memory Hierarchy Is Being Redefined

3+ week, 10+ hour ago   (211+ words) A new direction is emerging in AI infrastructure in 2026: NAND flash is no longer being treated solely as storage inside SSDs. Instead, it is beginning to evolve toward a near-compute, high-bandwidth, high-capacity memory tier. One of the most representative technologies…...